Customer Background
A global aerospace and defense company with a diverse portfolio, providing cutting-edge solutions for military, aerospace, and commercial sectors.
Challenge
The customer requires a high-reliability, repeatable cleaning process for high-density electronic assemblies. Printed circuit boards (PCBs) with low standoff and densely populated components must be cleaned thoroughly while minimizing chemical drag-out, preventing contamination between stages, and ensuring consistent process control. Additionally, the system must support production-level throughput and meet stringent quality and environmental expectations.
Solution
An inline aqueous cleaning system with Flood Box™ technology was selected to fully submerge PCBs during washing, improving cleaning beneath low standoff and high-density components. The process integrates wash, rinse, and drying stages to deliver consistent, high-reliability results in a production environment.
Cleaning Method:
Inline, multi-stage aqueous cleaning process including:
• Flood immersion wash
• Spray-in-air wash and rinse
• Isolation rinse to prevent drag-out
• Recirculating heated rinse
• Final freshwater rinse
• Air knife and thermal drying
The Flood Box fully submerges assemblies, ensuring complete penetration beneath components and removing trapped contaminants.
